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NSN 5961-01-545-0497, 5961015450497
RECTIFIER,SEMICONDUCTOR DEVICE,U

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 015450497
Codification Country
United States
Item Name Code
INC 62108
Criticality
(Y) This item does not have a nuclear hardened feature but does have other critical feature(s) such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
Availability: Request Qualified Suppliers: Currently qualifying suppliers

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DLMS® Summary

National Stock Number 5961-01-545-0497

National Stock Number (NSN) 5961-01-545-0497, or NIIN 015450497, (rectifier,semiconductor device,u) was assigned October 31, 2006 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are 2 manufacturer part numbers associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years, with the most recent procurement date of Dec 01, 2011. There has been one contract issued for this part number, with one award given. The US Government has only awarded those contracts to one supplier. The last contract numbers awarded were: SPM4A512MA983, SPM4A512MA983. The total value of the awarded contracts has been US$ 29,092.00.

This NSN is unique to one weapons system.

There has been very little demand for this national stock number. The demand for this NSN originated from less than 5 countries. Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Jun 02, 2010, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. This part requires engineering source approval by the design control activity in order to maintain the quality of the part. An alternate source must qualify in accordance with the design control activity's procedures, as approved by the cognizant Government engineering activity. Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 62108. [TWO OR MORE DIODE SEMICONDUCTOR DEVICES DESIGNED TO FUNCTION AS A UNIT IN CHANGING ALTERNATING CURRENT TO DIRECT CURRENT. THE DIODE DEVICES ARE INTERNALLY CONNECTED IN SERIES, AND ARE PERMANENTLY CASED, ENCAPSULATED, POTTED, OR MOLDED TOGETHER TO FORM AN INSEPARABLE UNIT. THESE UNITS MAY BE DESIGNED AS EITHER HALF-WAVE OR FULL-WAVE RECTIFIERS AND MAY BE MOUNTED TO FORM EITHER SINGLE PHASE OR THREE PHASE BRIDGES. FOR INTERCONNECTED ITEMS ARRANGED IN STACK(S), SEE RECTIFIER, SEMICONDUCTOR DEVICE. FOR ITEMS FABRICATED IN THE FORM OF A MONOLITHIC OR THIN FILM STRUCTURE THAT PERFORM THE FUNCTION OF A CIRCUIT, SEE INTEGRATED CIRCUIT (AS MODIFIED). EXCLUDES SEMICONDUCTOR DEVICES, UNITIZED; SEMICONDUCTOR DEVICE ASSEMBLY; AND RECTIFIER NETWORK, UNITIZED.]. This item does not have a nuclear hardened feature but does have other critical feature(s) such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961015450497 does not contain precious metals.

This NSN is associated to Schedule B 8541900000: diode, transistor & similar semiconductor device parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

END ITEM IDENTIFICATION
(AGAV) MV-22 AIRCRAFT
CRITICALITY CODE JUSTIFICATION
(CRTL) AGAV
SPECIAL FEATURES
(FEAT) INAVY - RECTIFIER; SCREENED RECTIFIER; DIODES FABRICATED UTILIZING HIGH TEMPERATURE METALLURGICAL BONDING BETWEEN BOTH SIDES OF SILICONE DIE AND TERMINAL PINS; DIODES HERMETICALLY SEALED; TERMINAL FINISH SHALL BE SOLDERABLE

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