National Stock Number
5998-00-925-7672
National Stock Number (NSN) 5998-00-925-7672, or NIIN 009257672, (printed wiring board) was assigned January 24, 1966 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There is only one manufacturer part number associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
This NSN is unique to one weapons system.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Jun 02, 2006, this NSN's acquisition method was noted as: Not established. Not established.
This NSN is assigned to Item Name Code (INC) 61737. [AN INSULATING PANEL UPON WHICH COMPLETELY PROCESSED ELECTRICAL CONDUCTOR PATHS ARE DEPOSITED, ETCHED, OR PRINTED IN VARIOUS PATTERNS TO PROVIDE OR COMPLETE A CIRCUIT BETWEEN TWO OR MORE POINTS. IT MAY PROVIDE CONTACTS FOR PLUG-IN CONNECTING FACILITIES. IT MAY BE DESIGNED FOR PANEL OR CHASSIS MOUNTING, OR FOR INSERTION INTO A CONNECTOR, RECEPTACLE, ELECTRICAL. FOR ITEMS CONTAINING PRINTED ELECTRONIC COMPONENTS, SEE PRINTED CIRCUIT BOARD. FOR ITEMS CONTAINING SEPARATELY MANUFACTURED ELECTRONIC COMPONENTS, SEE CIRCUIT CARD ASSEMBLY. FOR ITEMS CONSISTING ONLY OF ELECTRICAL CONDUCTOR PATHS AND TWO OR MORE CONNECTORS, SEE BACKPLANE ASSEMBLY.]. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998009257672 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Nov 01, 2024.