National Stock Number
5998-01-086-3293
National Stock Number (NSN) 5998-01-086-3293, or NIIN 010863293, (extender card,electronic test) was assigned November 25, 1979 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There is only one manufacturer part number associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
This NSN is somewhat common among different platforms, belonging to 6 different weapons systems.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Jan 01, 2013, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. The data or the rights to use the data needed to purchase this part from additional sources are not owned by the Government and it has been determined that it is uneconomical to purchase them. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 62400. [AN ITEM CONSISTING OF A HAND WIRED OR PRINTED WIRING BOARD, WITH OR WITHOUT A RETAINING PLATE, RAILS, BRACKETS, OR ELECTRICAL CONNECTOR(S) WHICH IS DESIGNED TO PROVIDE ACCESS TO A CIRCUIT CARD ASSEMBLY OR ELECTRONIC COMPONENTS ASSEMBLY FOR TESTING, TEST POINT CHECKING AND TROUBLESHOOTING.]. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998010863293 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Nov 01, 2024.