National Stock Number
5998-01-540-0297
National Stock Number (NSN) 5998-01-540-0297, or NIIN 015400297, (printed circuit board) was assigned May 8, 2006 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are no manufacturer part numbers associated to this NSN.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on May 26, 2017, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. Procurement of this item restricted to limited source(s) because security classifiation of confidential or higher prevents public disclosure. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 60843. [A PRINTED WIRING BOARD HAVING ONLY PRINTED ELECTRONIC COMPONENTS, SUCH AS CAPACITORS, RESISTORS, AND THE LIKE. FOR ITEMS HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, USE APPLICABLE ITEM NAME, SUCH AS AMPLIFIER (AS MODIFIED); POWER SUPPLY; OR THE LIKE. FOR ITEMS NOT HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, SEE APPLICABLE "SUBASSEMBLY" NAME, SUCH AS AMPLIFIER SUBASSEMBLY; POWER SUPPLY SUBASSEMBLY; OR THE LIKE. FOR ITEMS HAVING SEPARATELY MANUFACTURED COMPONENTS (OTHER THAN PLUG-IN CONNECTING FACILITIES) AND NOT HAVING A MORE SPECIFIC ITEM NAME, SEE CIRCUIT CARD ASSEMBLY.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998015400297 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Oct 01, 2024.