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NSN 5962-01-295-2354, 5962012952354
MICROCIRCUIT,DIGITAL

Federal Supply Classification
FSC 5962 - Microcircuits, Electronic
National Item Identification Number
NIIN 012952354
Codification Country
United States
Item Name Code
INC 31779
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5962-01-295-2354

National Stock Number (NSN) 5962-01-295-2354, or NIIN 012952354, (microcircuit,digital) was assigned March 2, 1989 in the Federal Logistics Information System (FLIS). This NSN does not replace any other NSNs.

There are 2 manufacturer part numbers associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, there are no suppliers listed as an Active supplier for this NSN. Of the active suppliers, there are no suppliers that are deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years.

This NSN is assigned to Item Name Code (INC) 31779. [A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5962012952354 does not contain precious metals.

This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

INCLOSURE CONFIGURATION
(CQSZ) LEADLESS FLAT PACK
TEST DATA DOCUMENT
(TEST) 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
STORAGE TEMP RANGE
(AFJQ) -65.0/+150.0 DEG CELSIUS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC
(CZEN) 7.0 VOLTS MAXIMUM POWER SOURCE
DESIGN FUNCTION AND QUANTITY
(CSSL) 1 FLIP-FLOP AND 1 SHIFT REGISTER
OPERATING TEMP RANGE
(AFGA) -55.0/+125.0 DEG CELSIUS
STORAGE TEMP RANGE
(AFJQ) -65.0 TO 150.0 DEG CELSIUS
OPERATING TEMP RANGE
(AFGA) -55.0 TO 125.0 DEG CELSIUS
FEATURES PROVIDED
(CBBL) W/CLOCK AND MONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND SCHOTTKY
OUTPUT LOGIC FORM
(CQWX) TRANSISTOR-TRANSISTOR LOGIC
SPECIAL FEATURES
(FEAT) MULTICHIP
INCLOSURE MATERIAL
(CQSJ) CERAMIC
INPUT CIRCUIT PATTERN
(CQZP) 14 INPUT
TERMINAL SURFACE TREATMENT
(CWSG) SOLDER
TERMINAL TYPE AND QUANTITY
(TTQY) 26 LEADLESS

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