National Stock Number
5962-01-552-3565
National Stock Number (NSN) 5962-01-552-3565, or NIIN 015523565, (microcircuit,digital) was assigned June 12, 2007 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are no manufacturer part numbers associated to this NSN.
This part number has not been procured by the US Government in over 5 years, with the most recent procurement date of Nov 02, 2009. There has been one contract issued for this part number, with one award given. The US Government has only awarded those contracts to one supplier. The last contract numbers awarded were: SPM7M510M0742, SPM7M510M0742, SPM7M510M0742, SPM7M510M0742. The total value of the awarded contracts has been US$ 1,496.00.
There has been very little demand for this national stock number. The demand for this NSN originated from less than 5 countries. Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Apr 11, 2008, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) Acquisition of this part is controlled by QPL procedures. Valid AMCs: 1 and 2.
This NSN is assigned to Item Name Code (INC) 31779. [A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5962015523565 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Nov 01, 2024.